News Article
Osram orders Altatech`s inspection and metrology system
The tool, capable of dealing with 4 inches (~100mm) to 300 mm in diameter. will be used to inspect LED wafers
Altatech, a subsidiary of Soitec, has received an order for its Orion LedMax wafer inspection and metrology system from Osram Opto Semiconductor.
Osram will use the tool to improve the performance, cost efficiency and yield of its LED-processing operations.
The inspection system is suitable for both volume manufacturing and R&D applications and will perform production control and new product qualification of Osram’s epitaxial wafers used in fabricating LEDs.
Capable of inspecting wafers from four inches to eight inches in diameter, Altatech’s Orion system combines the diverse capabilities of 2D inspection, defect height measurement and dark-field inspection in one platform, producing the industry’s most thorough and meaningful wafer-metrology results.
This state-of-the-art solution outperforms more expensive systems on today’s market by generating more information than just diffracted light signature, identifying potentially critical defects amid noisy backgrounds, providing superior matching performance and reducing maintenance costs.
“After a very extensive evaluation of available options, Osram’s selection of our Orion system confirms both the performance and the cost efficiency of our solution,” says Jean-Luc Delcarri, general manager of Soitec’s Altatech subsidiary. “The integrated functions of our holistic inspection systems are unique and unmatched in any other suppliers’ production tools.”
Orion offers the full range of inspection and metrology capabilities for front-end manufacturing process flows including incoming wafer qualification, process development and line monitoring.
Proprietary Orion modules are designed to conduct front side and back side surface inspection, edge inspection, bump and through-silicon-via (TSV) metrology by detecting, counting and classifying defects on patterned and unpatterned wafers.
Altatech’s line of advanced metrology and inspection products includes:
The Orion system for inspecting LEDs on patterned and unpatterned substrates
The Eclipse series for front-side, back-side and edge inspection of bare substrates, epitaxial layers, silicon-on-insulator (SOI) wafers and glass substrates
The Comet series for quality inspection of wafers mounted on film-frame or Taico rings before and after dicing
All of these systems are designed to handle wafers from 4 inches to 300 mm in diameter or mounted on supporting rings.
Osram will use the tool to improve the performance, cost efficiency and yield of its LED-processing operations.
The inspection system is suitable for both volume manufacturing and R&D applications and will perform production control and new product qualification of Osram’s epitaxial wafers used in fabricating LEDs.
Capable of inspecting wafers from four inches to eight inches in diameter, Altatech’s Orion system combines the diverse capabilities of 2D inspection, defect height measurement and dark-field inspection in one platform, producing the industry’s most thorough and meaningful wafer-metrology results.
This state-of-the-art solution outperforms more expensive systems on today’s market by generating more information than just diffracted light signature, identifying potentially critical defects amid noisy backgrounds, providing superior matching performance and reducing maintenance costs.
“After a very extensive evaluation of available options, Osram’s selection of our Orion system confirms both the performance and the cost efficiency of our solution,” says Jean-Luc Delcarri, general manager of Soitec’s Altatech subsidiary. “The integrated functions of our holistic inspection systems are unique and unmatched in any other suppliers’ production tools.”
Orion offers the full range of inspection and metrology capabilities for front-end manufacturing process flows including incoming wafer qualification, process development and line monitoring.
Proprietary Orion modules are designed to conduct front side and back side surface inspection, edge inspection, bump and through-silicon-via (TSV) metrology by detecting, counting and classifying defects on patterned and unpatterned wafers.
Altatech’s line of advanced metrology and inspection products includes:
The Orion system for inspecting LEDs on patterned and unpatterned substrates
The Eclipse series for front-side, back-side and edge inspection of bare substrates, epitaxial layers, silicon-on-insulator (SOI) wafers and glass substrates
The Comet series for quality inspection of wafers mounted on film-frame or Taico rings before and after dicing
All of these systems are designed to handle wafers from 4 inches to 300 mm in diameter or mounted on supporting rings.
